Toshiba Electronics Europe (TEE)
Toshiba Electronics Europe (TEE) is the European Headquarters for the Memory products and various other electronic components business of Toshiba Corporation, which is the world's fourth largest semiconductor vendor according to estimates by Dataquest.
TEE was formed in 1973 in Neuss, Germany. The company now has headquarters in Düsseldorf, Germany and subsidiaries in France, Italy, Spain, Sweden and the United Kingdom. Company president is Mr Shikama and the total number of personnel in Europe is around 400.
Toshiba: World's Largest Producer of MLC NAND Memory
As the recognized pioneer in Flash technology, Toshiba was a principal innovator of both NOR-type and NAND-type Flash technology in the 1980's.
Today, Toshiba is the leading supplier of Multi-Level Cell NAND Flash memory. Toshiba's memory products are designed to meet the growing needs of wireless and handheld systems such as cellular phones, personal digital assistants (PDAs), and global positioning systems (GPS); consumer electronics such as silicon audio (MP3), digital still camera (DSC), digital video recorder and high density removable storage cards and flash drives; as well as industrial applications.
Enabling the growing demand for increasing data storage, Toshiba also offers an extensive line of embedded NAND solutions and digital media storage solutions such as SD™, SDHC™, miniSDT and microSD™ memory cards, USB flash drives and CompactFlash® memory cards.
Toshiba has a vast selection of digital media solutions in a wide range of densities for a variety of applications. These include digital still and video cameras, audio players, PDAs, portable and desktop computers, mobile phones, home entertainment systems and more.
Highlights:
- World's second largest Flash memory supplier
- Principal innovator of NAND and NOR Flash
- 16Gb NAND Flash on 56nm process technology
- 32Gb stacked NAND Flash achieves 4GB high capacity of storage
- First-to-market advantages
- Sep 4th, 07 : the opening of Fab 4, the latest and largest 300mm wafer fab. Facility at Yokkaichi Operations, in Mie Pref., Japan.
- Consistent semiconductor capital investments of ~$2B annually.
